Skip to main content

Electronic devices and circuits


Electronic devices: Energy bands in silicon, intrinsic and extrinsic silicon. Carrier transport in silicon: diffusion current, drift current, mobility, resistivity. Generation and recombination of carriers. p-n junction diode, Zener diode, tunnel diode, BJT, JFET, MOS capacitor, MOSFET, LED, p-i-n and avalanche photo diode, LASERs. Device technology: integrated circuit fabrication process, oxidation, diffusion, ion implantation, photolithography, n-tub, p-tub and twin-tub CMOS process.
Analog circuits: Equivalent circuits (large and small-signal) of diodes, BJTs, JFETs, and MOSFETs. Simple diode circuits, clipping, clamping, rectifier. Biasing and bias stability of transistor and FET amplifiers. Amplifiers: single-and multi-stage, differential, operational, feedback and power. Analysis of amplifiers; frequency response of amplifiers. Simple op-amp circuits. Filters. Sinusoidal oscillators; criterion for oscillation; single-transistor and op-amp configurations. Function generators and wave-shaping circuits, Power supplies.
Digital circuits: Boolean functions (NOT, AND, OR, XOR,...). Logic gates digital IC families (DTL, TTL, ECL, MOS, CMOS). Combinational circuits: arithmetic circuits, code converters, multiplexers and decoders. Sequential circuits: latches and flip-flops, counters and shift-registers. Sample and hold circuits, ADCs, DACs. Semiconductor memories. Microprocessor 8086: architecture, programming, memory and I/O interfacing.
Signals and systems
Control systems
Communications
Definitions and properties of Laplace transform, continuous-time and discrete-time Fourier series, continuous-time and discrete-time Fourier Transform, z-transform. Sampling theorems. Linear Time-Invariant (LTI) Systems: definitions and properties; causality, stability, impulse response, convolution, poles and zeros frequency response, group delay, phase delay. Signal transmission through LTI systems. Random signals and noise: probability, random variables, probability density function, autocorrelation, power spectral density, function analogy between vectors & functions.
Basic control system components; block diagrammatic description, reduction of block diagrams — Mason's rule. Open loop and closed loop (negative unity feedback) systems and stability analysis of these systems. Signal flow graphs and their use in determining transfer functions of systems; transient and steady state analysis of LTI control systems and frequency response. Analysis of steady-state disturbance rejection and noise sensitivity.
Tools and techniques for LTI control system analysis and design: root loci, Routh-Hurwitz stability criterion, Bode and Nyquist plots. Control system compensators: elements of lead and lag compensation, elements of Proportional-Integral-Derivative controller (PID). Discretization of continuous time systems using Zero-order hold (ZOH) and ADCs for digital controller implementation. Limitations of digital controllers: aliasing. State variable representation and solution of state equation of LTI control systems. Linearization of Nonlinear dynamical systems with state-space realizations in both frequency and time domains. Fundamental concepts of controllability and observability for MIMO LTI systems. State space realizations: observable and controllable canonical form. Ackermann's formula for state-feedback pole placement. Design of full order and reduced order estimators.
Analog communication systems: amplitude and angle modulation and demodulation systems, spectral analysis of these operations, superheterodyne noise conditions.
Digital communication systems: pulse-code modulation (PCM), differential pulse-code modulation (DPCM), delta modulation (DM), digital modulation – amplitude, phase- and frequency-shift keying schemes (ASK, PSK, FSK), matched-filter receivers, bandwidth consideration and probability of error calculations for these schemes, GSM, TDMA.

Labels:

Comments

Post a Comment

Popular posts from this blog

Soldering and brazing

The distinction between soldering and brazing is based on the melting temperature of the filler alloy. A temperature of 450 °C is usually used as a practical delineating point between soldering and brazing . Soft soldering can be done with a heated iron whereas the other methods require a higher temperature torch or furnace to melt the filler metal. Different equipment is usually required since a soldering iron cannot achieve high enough temperatures for hard soldering or brazing. Brazing filler metal is stronger than silver solder, which is stronger than lead-based soft solder. Brazing solders are formulated primarily for strength, silver solder is used by jewelers to protect the precious metal and by machinists and refrigeration technicians for its tensile strength but lower melting temperature than brazing, and the primary benefit of soft solder is the low temperature used (to prevent heat damage to electronic components and insulation). Since the joint is ...
Post a Comment
Read more

Electromagnetics

Elements of vector calculus: divergence and curl; Gauss' and Stokes' theorems, Maxwell's equations: differential and integral forms. Wave equation, Poynting vector. Plane waves: propagation through various media; reflection and refraction; phase and group velocity; skin depth. Transmission lines: characteristic impedance; impedance transformation; Smith chart; impedance matching; pulse excitation. Waveguides: modes in rectangular waveguides; boundary conditions; cut-off frequencies; dispersion relations. Antennas: Dipole antennas; antenna arrays; radiation pattern; reciprocity theorem, antenna gain. Network analysis Electronic devices and circuits Signals and systems Control systems Network graphs: matrices associated with graphs; incidence, fundamental cut set and fundamental circuit matrices. Solution methods: nodal and mesh analysi...
Post a Comment
Read more